报告内容摘要：A new class of planar, wavelength-thick optical components exhibiting exceptional optical properties have emerged in recent years. These artificial interfaces, known as metasurfaces, rely on the scattering properties of the subwavelength structures patterned at interfaces to manipulate the wavefront of light in almost any desired manner.To further develop this technology towards dynamic tuning broadband applications and industrial production, new materials and new fabrication methods are required .In this presentation, I will introduce basic design and fabrication methods of semiconductor-based metasurfaces and demonstrate exciting new monolithic integration of metasurfaces onto VCSEls under back emitting configuration. Our wafer-level nonintrusive approach addresses the issues of arbitrary shaping laser beams with programmable controllability for various laser beam shaping applications.